Samsung Galaxy S7 Rear Camera Module
——逆向分析報(bào)告
三星GalaxyS7選擇了最好的CMOS圖像傳感器技術(shù)
三星GalaxyS7集成了Sony新款CMOS圖像傳感器：IMX260，其采用全像素雙核（full‘DualPixel’）相位檢測(cè)自動(dòng)對(duì)焦、采用深溝槽隔離（DTI）和銅-銅混合鍵合技術(shù)。
全像素雙核是指圖像傳感器上每個(gè)像素都擁有兩個(gè)光電二極管，而這兩個(gè)光電二極管會(huì)分別接收光線并獲取2個(gè)信號(hào)，之后即可進(jìn)行相差檢測(cè)自動(dòng)對(duì)焦，而成像時(shí)會(huì)拼合2個(gè)光電二極管積蓄的電荷作為1個(gè)像素進(jìn)行讀取。簡(jiǎn)單理解就是在一個(gè)像素內(nèi)對(duì)焦和成像同時(shí)進(jìn)行，既保持了畫質(zhì)又增加了對(duì)焦速度。
IMX260雖然只有1200萬(wàn)像素，但是像素尺寸更大（1.4微米）、光圈更大（F/1.7）、自動(dòng)對(duì)焦更好，尤其在低光環(huán)境下拍照簡(jiǎn)直堪稱完美。該攝像頭模組的紅外濾波采用的塑料片，不像iPhone6SPlus采用的是比較常見的藍(lán)色玻璃濾光片。
三星GalaxyS7后置攝像頭模組
三星GalaxyS7后置攝像頭模組尺寸為12x12x5.3mm，集成了6-elements透鏡模組和音圈馬達(dá)（VCM）自動(dòng)對(duì)焦執(zhí)行器。該攝像頭模組還有一顆專門用來(lái)調(diào)焦的二軸陀螺儀（來(lái)自意法半導(dǎo)體），以及光學(xué)防抖驅(qū)動(dòng)程序（來(lái)自瑞薩）和串行閃存（來(lái)自華邦）。
IMX260圖像傳感器剖面圖
本報(bào)告介紹對(duì)三星GalaxyS7后置攝像頭模組和IMX260圖像傳感器進(jìn)行詳細(xì)的結(jié)構(gòu)、工藝、材料和成本分析，并與iPhone6SPlus后置攝像頭模組進(jìn)行對(duì)比。
報(bào)告目錄：
Overview and Introduction
Supply Chain and Company Profile
Samsung Galaxy S7 Teardown
Physical Analysis? Camera module view and dimensions? Camera module disassembly? STMicroelectronics L2G2IS gyroscope? Renesas OIS driver? Winbond Serial flash memory? Cross-Section Camera Module (including Housing, AFA/OIS, IR Filter, FPC)? Comparison with Samsung Galaxy S6 and iPhone 6S Structure? CMOS Image Sensor- View and dimensions- Pads, wire bonding and Tungsten grid- CIS pixels- Logic circuit (main blocks, transistors, SRAM, ROM)? CMOS Image Sensor Cross-Section- Overview- Pixel Array circuit- Logic circuit- Pad trench- Cu-Cu hybrid bonding? Comparison with iPhone 6S and 6S Plus CMOS Image Sensor
CIS Manufacturing Process Flow? Global Overview? Logic Circuit Front-End Process? Pixel Array Circuit Front-End Process? BSI, Cu-Cu Hybrid Bonding and Microlens Processes? CIS Wafer Fabrication Unit
Cost Analysis? Cost Analysis Synthesis? The Main Steps Used in the Economic Analysis? Yield Hypotheses? CMOS Image Sensor Cost- Logic circuit front-end cost- Pixel Array front-end cost- BSI and Cu-Cu hybrid bonding front-end cost- Color filter and Microlens frontend cost- Total front-end cost- Back-end: tests and dicing- CIS wafer and die cost? Camera Module Assembly Cost- Lens module cost- AFA/OIS cost- Final assembly cost? Camera Module Cost
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01月07日 18:14
